Kiwon Lee is Ph.D. student in the Department of Materials Science and Engineering at the Korea Advanced Institute of Science & Technology [KAIST] . He received his Master's Degree in Materials Science and Engineering from KAIST in 2007. He won a Motorola Fellowship Award as the author of the best student paper at the Electronic Components and Technology Conference, in Reno, Nevada in the USA in 2007, and won another 'Best Student Paper' Award at the International Conference on Electronic Materials and Packaging in Daejeon, Korea in 2007. His research focuses on the development of ultrasonic bonding processes using anisotropic conductive films (ACFs) for electronic devices. Lee Kiwon is currently a primary researcher in an 'ultrasonic bonding process' joint research project being carried by NOKIA and KAIST. kiwonlee@kaist.ac.krSunday 12 October 2008
Lee Kiwon
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Kiwon Lee is Ph.D. student in the Department of Materials Science and Engineering at the Korea Advanced Institute of Science & Technology [KAIST] . He received his Master's Degree in Materials Science and Engineering from KAIST in 2007. He won a Motorola Fellowship Award as the author of the best student paper at the Electronic Components and Technology Conference, in Reno, Nevada in the USA in 2007, and won another 'Best Student Paper' Award at the International Conference on Electronic Materials and Packaging in Daejeon, Korea in 2007. His research focuses on the development of ultrasonic bonding processes using anisotropic conductive films (ACFs) for electronic devices. Lee Kiwon is currently a primary researcher in an 'ultrasonic bonding process' joint research project being carried by NOKIA and KAIST. kiwonlee@kaist.ac.kr
Kiwon Lee is Ph.D. student in the Department of Materials Science and Engineering at the Korea Advanced Institute of Science & Technology [KAIST] . He received his Master's Degree in Materials Science and Engineering from KAIST in 2007. He won a Motorola Fellowship Award as the author of the best student paper at the Electronic Components and Technology Conference, in Reno, Nevada in the USA in 2007, and won another 'Best Student Paper' Award at the International Conference on Electronic Materials and Packaging in Daejeon, Korea in 2007. His research focuses on the development of ultrasonic bonding processes using anisotropic conductive films (ACFs) for electronic devices. Lee Kiwon is currently a primary researcher in an 'ultrasonic bonding process' joint research project being carried by NOKIA and KAIST. kiwonlee@kaist.ac.kr
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